| 摘要 |
A feature expansion module is provided which includes a generally rectangular body (11) installable in a host device (1), a first connection terminal (13) provided at one side of the body (11) for electrical connection with the host device (1), a feature expansion unit (44) provided inside the body (11) and having one or more functions, one or more recesses (22) formed contiguously to an insertion slot (23) formed at the other side of the body (11) and through which an integrated circuit chip (27) incorporating integrated circuit elements is inserted, to receive the integrated circuit chip (27), a second connection terminal (25) provided in the recess (22) for electrical connection with a group of terminals provided at the integrated circuit chip (27), and a controller (9) built in the body (11) to control the integrated circuit chip (27) set in the recess (22).
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