发明名称 Plasma processing method and apparatus
摘要 In a plasma processing method which comprises supplying a processing gas to a vacuum vessel 2 forming a plasma production part, producing a plasma 6 using an antenna 1 and a Faraday shield 8 which are provided at outer periphery of the vacuum vessel and to which a high-frequency electric power can be applied, and carrying out the processing, a voltage of at least 500 V is applied to the Faraday shield 8 and a sample 12 which is disposed in the vacuum vessel 2 and which is a nonvolatile material as a material to be etched is etched.
申请公布号 US2003160024(A1) 申请公布日期 2003.08.28
申请号 US20020083252 申请日期 2002.02.27
申请人 KAWAGUCHI TADAYASHI;KANEKIYO TADAMITSU;MITSUDA AKIHIKO;SHIMADA TAKESHI;KANAI SABUROU 发明人 KAWAGUCHI TADAYASHI;KANEKIYO TADAMITSU;MITSUDA AKIHIKO;SHIMADA TAKESHI;KANAI SABUROU
分类号 H01J37/32;(IPC1-7):C23F1/00;B44C1/22;C03C15/00;C03C25/68 主分类号 H01J37/32
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