发明名称 |
MODULE PART |
摘要 |
A module part, comprising mounting parts (1), wherein a circuit substrate (3) having one or more mounting parts (1) mounted on at least one surface thereof and a connection circuit substrate (5) having recessed parts (4) or holes for fitting the mounting parts (1) therein at portions corresponding to at least one or more mounting parts (1) mounted on one surface of the circuit substrate (3) are formed integrally with each other by stacking, whereby the reliability of an inter-layer connection can be assured, a plurality of mounting parts can be accurately and densely incorporated therein, a high reliability can be provided, and a size can be reduced. |
申请公布号 |
WO03071603(A1) |
申请公布日期 |
2003.08.28 |
申请号 |
WO2003JP01785 |
申请日期 |
2003.02.19 |
申请人 |
MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.;HIGASHITANI, HIROSHI;YASUHO, TAKEO;HAYAMA, MASAAKI |
发明人 |
HIGASHITANI, HIROSHI;YASUHO, TAKEO;HAYAMA, MASAAKI |
分类号 |
H01L21/48;H01L21/56;H01L23/498;H01L23/538;H01L25/065;H05K1/18;H05K3/46 |
主分类号 |
H01L21/48 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|