发明名称 MODULE PART
摘要 A module part, comprising mounting parts (1), wherein a circuit substrate (3) having one or more mounting parts (1) mounted on at least one surface thereof and a connection circuit substrate (5) having recessed parts (4) or holes for fitting the mounting parts (1) therein at portions corresponding to at least one or more mounting parts (1) mounted on one surface of the circuit substrate (3) are formed integrally with each other by stacking, whereby the reliability of an inter-layer connection can be assured, a plurality of mounting parts can be accurately and densely incorporated therein, a high reliability can be provided, and a size can be reduced.
申请公布号 WO03071603(A1) 申请公布日期 2003.08.28
申请号 WO2003JP01785 申请日期 2003.02.19
申请人 MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.;HIGASHITANI, HIROSHI;YASUHO, TAKEO;HAYAMA, MASAAKI 发明人 HIGASHITANI, HIROSHI;YASUHO, TAKEO;HAYAMA, MASAAKI
分类号 H01L21/48;H01L21/56;H01L23/498;H01L23/538;H01L25/065;H05K1/18;H05K3/46 主分类号 H01L21/48
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