| 发明名称 |
GROUND PLANE FOR EXPOSED PACKAGE |
| 摘要 |
A new design is provided for the design of a leadframe of a semiconductor package. A ground plane is added to the design of the leadframe, the ground frame is located between the leadframe and the die attach paddle over which the semiconductor device is mounted.
|
| 申请公布号 |
US2003160309(A1) |
申请公布日期 |
2003.08.28 |
| 申请号 |
US20020083993 |
申请日期 |
2002.02.26 |
| 申请人 |
ST ASSEMBLY TEST SERVICES PTE LTD |
发明人 |
PUNZALAN JEFFREY D.;TAN HIEN BOON;ZHENG ZHENG;YEE JAE HAK;HAN BYUNG JOON |
| 分类号 |
H01L23/495;(IPC1-7):H01L23/495 |
主分类号 |
H01L23/495 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
|
| 地址 |
|
