| 摘要 |
A stencil apparatus includes an elongated stencil support strip having at least one longitudinally extruding severance line, and at least one stencil support area between the severance line and the edge of the stencil support strip. Stencil elements with pressure sensitive adhesive on their lower surfaces are releasably mounted on the stencil support areas, and arrangements are provided for permitting the removal of material underlying the stencil elements. The stencil apparatus may be formed of either one or two layers and may have upper and lower support strips.
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