发明名称 |
Semiconductor device and manufactuiring method thereof |
摘要 |
A semiconductor chip 2 is disposed within a device hole as formed in a tape base material 1a of a tape carrier 1, which chip is smaller in thickness than the tape base material 1a, and then sealing is performed by a seal resin 3 to permit both the principal surface and back surface of such semiconductor chip 2 to be coated therewith. And, the position of the semiconductor chip 2 in a direction along the thickness of the tape base 1a is set to correspond to a stress neutral plane of the TCP as a whole.
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申请公布号 |
US2003162326(A1) |
申请公布日期 |
2003.08.28 |
申请号 |
US20030426714 |
申请日期 |
2003.05.01 |
申请人 |
TSUBOSAKI KUNIHIRO;MIYAMOTO TOSHIO |
发明人 |
TSUBOSAKI KUNIHIRO;MIYAMOTO TOSHIO |
分类号 |
H01L21/60;H01L21/44;H01L21/461;H01L21/50;H01L21/56;H01L23/495;H01L23/498;H01L25/065;H01L25/10;(IPC1-7):H01L21/50 |
主分类号 |
H01L21/60 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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