| 摘要 |
Environmental sensors (2) and other bodies, together with associated lead wires (6), are mounted to a oxidizable substrate (4) for high temperature applications by means of a reacted borosilicate mixture (RBM) (18, 20) that secures the body relative to the substrate via of an oxide interface (22) formed between the RBM and substrate during a high temperature reaction process. An oxide interface (24) is also formed with oxidizable bodies to provide further mounting strength. The RBM is a B>2<0>3<-SiO>2< mixture, with the B>23< portion at least 70 wt.% and preferably at least 75 wt.% for adhesion purposes, and at least 50 wt.% for encapsulation purposes. |
