发明名称 |
Adhesive composition, method for preparing the same, adhesive film using the same, substrate for carrying semiconductor and semiconductor device |
摘要 |
There are disclosed an adhesive composition comprising: (a) an epoxy resin, (b) a curing agent and (c) a polymer compound with a weight average molecular weight of 100,000 or more, wherein a ratio of A/B exceeds 1 and is 10 or less, where A represents the total weight of (a) the epoxy resin and (b) the curing agent and B represents a weight of (c) the polymer compound; an adhesive composition, whose compositions are separated into a sea phase and an island phase, when viewed at a section in a cured state, and a ratio X/Y is in a range of 0.1 to 1.0, where X is an area of the sea phase and Y is an area of the island phase; a process for producing said adhesive composition; an adhesive film wherein said adhesive composition is formed into a film form; an adhesive film for bonding a semiconductor chip and a wiring board for mounting a semiconductor or for bonding semiconductor chips themselves, wherein the adhesive film can perform bonding by heat-pressing with a pressure of 0.01 to 0.5 MPa; a wiring board for mounting a semiconductor equipped with said adhesive film on a surface for mounting a semiconductor chip; and a semiconductor device using said adhesive film or said wiring board for mounting a semiconductor.
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申请公布号 |
US2003159773(A1) |
申请公布日期 |
2003.08.28 |
申请号 |
US20030240265 |
申请日期 |
2003.02.21 |
申请人 |
TOMIYAMA TAKEO;INADA TEIICHI;YASUDA MASAAKI;HATAKEYAMA KEIICHI;HASEGAWA YUUJI;NISHIYAMA MASAYA;MATSUZAKI TAKAYUKI;URUNO MICHIO;SUZUKI MASAO;IWAKURA TETSUROU;SHIMADA YASUSHI;TANAKA YUUKO;KURIYA HIROYUKI;SUMIYA KEIJI |
发明人 |
TOMIYAMA TAKEO;INADA TEIICHI;YASUDA MASAAKI;HATAKEYAMA KEIICHI;HASEGAWA YUUJI;NISHIYAMA MASAYA;MATSUZAKI TAKAYUKI;URUNO MICHIO;SUZUKI MASAO;IWAKURA TETSUROU;SHIMADA YASUSHI;TANAKA YUUKO;KURIYA HIROYUKI;SUMIYA KEIJI |
分类号 |
C09J7/00;C09J7/02;C09J163/00;H01L21/58;H01L21/68;(IPC1-7):B32B31/00 |
主分类号 |
C09J7/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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