| 摘要 |
<p>The described embodiments relate to methods and systems for laser micromachining a substrate (206). One exemplary embodiment positions (802) a substrate (206) in an open air environment (403). The substrate (206) has a thickness defined by opposing first (210) and second (212) surfaces. The substrate (206) can be cut by directing (804) a laser beam (406) at the first surface (210) of the substrate (206) and introducing (806) an assist gas (414) proximate to a region (411) of the substrate (206) contacted by the laser beam (406).</p> |
