发明名称 |
Opto-electrical module packaging |
摘要 |
The opto-electrical module packaging installs opto-electrical devices on a conductive leadframe to form an opto-electrical module. The opto-electrical module is then packaged using a molding packaging means, forming a transparent plastic base. The transparent plastic base is installed with a convergent lens to focus light. The leadframe has a plurality of pins and is mounted on the circuit board by soldering. This forms a packaging structure without bare pins exposed to the environment. In addition, the leadframe has a precision alignment structure extending outward as the alignment mechanism when assembled with a fiber connector. The precision packaging procedure provides a precision alignment of the converging lens and the opto-electrical devices at the same time.
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申请公布号 |
US2003161367(A1) |
申请公布日期 |
2003.08.28 |
申请号 |
US20030361686 |
申请日期 |
2003.02.11 |
申请人 |
CHEN WEN-YAN;FENG RONG-CHANG;LIU CHUN-KAI |
发明人 |
CHEN WEN-YAN;FENG RONG-CHANG;LIU CHUN-KAI |
分类号 |
H01S5/00;H01S5/022;H01S5/183;(IPC1-7):H01S3/04 |
主分类号 |
H01S5/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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