发明名称 Flip-chip structure for light emitting diode (LED) with silicon substrate, has conductors defined as plus and minus poles by chip
摘要 <p>The Si substrate (1) contains, on one surface, evenly spaced conductors (11), between which is fitted a current interrupting zone (12). At least one chip (2) has on the same surface a plus (21) and a minus terminal (22). They are so fitted, as flip-chip, on the substrate that the two terminals are electrically coupled to the conductors. Thus both end of conductors are defined as plus and minus poles by the chip. The conductors, not coupled to chip, can be connected to external current source.</p>
申请公布号 DE20309446(U1) 申请公布日期 2003.08.28
申请号 DE2003209446U 申请日期 2003.06.18
申请人 PARA LIGHT ELECTRONICS CO., LTD. 发明人
分类号 H01L23/14;H01L25/075;H01L33/48;H01L33/64;(IPC1-7):H01L33/00;H01L23/28;H01L23/495 主分类号 H01L23/14
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