发明名称 THERMAL DISSIPATION ASSEMBLY FOR ELECTRONIC COMPONENTS
摘要 An electrical assembly 10 is providing, including a heat sink case 14, a heat generating component 12, a gap 16 defined between the heat generating component 12 and the heat sink 14, a thermally conductive adhesive 18 positioned within the gap16 including a plurality of physical barrier elements 20 positioned within said thermally conductive adhesive 18, and at least one spacer strip 26 positioned within at least a portion of the gap 16 to reduce damage to the heat generating component 12 cause by the physical barrier elements 20.
申请公布号 US2003161105(A1) 申请公布日期 2003.08.28
申请号 US20010970180 申请日期 2001.10.04
申请人 KATARIA VIJAY 发明人 KATARIA VIJAY
分类号 H01L23/373;H01L23/433;H05K7/20;(IPC1-7):H05K7/20 主分类号 H01L23/373
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