| 摘要 |
A hybrid coupler 10, 90, 110, 130, 160, 210 includes a substrate 12 having a coupling structure formed thereon using thick film processing techniques. The coupling structure includes two parallel conductive strips 21, 31. One strip 21 is coupled at one end to an incident port 22 and at the other end to a direct port 23. The other strip 31 is coupled at one end to a coupled port 32 and at the other end to an isolated port 33. An electrically conductive shield 71, 91, 111, 164 is aligned with and enhances coupling between the conductive strips. A dielectric layer 61, 162 is provided between the shield and the conductive strips. |
