| 摘要 |
PROBLEM TO BE SOLVED: To provide an epoxy resin composition having good flow properties and solder crack resistance. SOLUTION: The semiconductor-sealing epoxy resin composition essentially includes (A) an epoxy resin having a binuclear compound content of 10-60% represented by general formula (1), wherein R denotes hydrogen or a 1-4C alkyl group and may the same or different mutually; (a) is an integer of 0-3; and (n) is a positive number of 1-10 in average, (B) a phenol resin, (C) an inorganic filer and (D) a curing promoter. COPYRIGHT: (C)2003,JPO
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