| 发明名称 |
APPARATUS FOR ENCAPSULATING WITH PLASTIC A LEAD FRAME WITH CHIPS |
| 摘要 |
<p>The invention relates to an apparatus for encapsulating with plastic lead frames carrying chips, comprising mutually movable mould halves (102, 103) which in the closed position bound a mould cavity for receiving a lead frame, a feed runner connecting onto the mould cavity for supplying encapsulating material and a plunger-cylinder (175) connected onto this feed runner for carrying up encapsulating material under pressure, characterized in that at a distance from the head end of the plunger (175) a peripheral groove (170) is arranged which is connected to the head end by means of at least one flow channel (171).</p> |
| 申请公布号 |
EP0708985(B1) |
申请公布日期 |
2003.08.27 |
| 申请号 |
EP19950916859 |
申请日期 |
1995.05.04 |
| 申请人 |
FICO B.V. |
发明人 |
PETERS, HENDRIKUS, JOHANNES, BERNARDUS |
| 分类号 |
B29C45/02;B29C45/53;B29C45/58;B29C49/02;H01L21/56;H01L23/31;H01L23/498;H01L23/58;(IPC1-7):H01L21/56 |
主分类号 |
B29C45/02 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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