发明名称 RADIATION-SENSITIVE RESIN COMPOSITION
摘要 <P>PROBLEM TO BE SOLVED: To provide a radiation-sensitive resin composition capable of forming a radiation-sensitive resin composition film thicker than plating and having high resolution. <P>SOLUTION: The radiation-sensitive resin composition comprises (A) an unsaturated group-containing alkali-soluble resin obtained by reacting 100 pts.wt. copolymer consisting of 1-40 wt.% constitutional units derived from a radical- polymerizable compound (a) having a carboxyl group, 1-50 wt.% constitutional units having a phenolic hydroxyl group derived from a radical-polymerizable compound (b-1) having a phenolic hydroxyl group or a radical-polymerizable compound (b-2) having a functional group convertible to a phenolic hydroxyl group after synthesis of the copolymer and the balance constitutional units derived from another radical-polymerizable compound (c) with 0.1-20 pts.wt. radical-polymerizable compound (d) having an epoxy group, (B) a compound having at least one ethylenically unsaturated double bond and (C) a radiation radical polymerization initiator. <P>COPYRIGHT: (C)2003,JPO
申请公布号 JP2003241372(A) 申请公布日期 2003.08.27
申请号 JP20020040301 申请日期 2002.02.18
申请人 JSR CORP 发明人 IWANAGA SHINICHIRO;IWAMOTO SATOSHI;KIMURA TORU;NISHIMURA YOKO;NISHIKAWA KOJI
分类号 G03F7/027;C08F290/12;G03F7/004;G03F7/033;G03F7/40;H01L21/027 主分类号 G03F7/027
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