SEMICONDUCTOR WAFER, SOLDER BUMP MEASUREMENT PROBE, AND VERTICAL PROBE CARD USING IT

摘要

PROBLEM TO BE SOLVED: To facilitate electrical connection between respective parts, to easily cope with breakage of a probe, and to comply with a high-frequency signal. SOLUTION: This solder bump measurement probe is provided with an upper end terminal part 110A touching a lower contact pad 222A of an intermediate base board 220A in a vertical probe card 200A, a contact 120A perpendicularly touching a conductive pad 610 in a semiconductor integrated circuit 600 as a measurement object, a lower end terminal part 130A thicker than the contact 120A in diameter and protruding the contact from the lower face, and a connection part 140A electrically and mechanically connecting the lower end terminal part 130A with the upper end terminal part 110A. The connection part 140A is a plate spring having a plurality of flexible parts 141A. COPYRIGHT: (C)2003,JPO