发明名称 THINNER COMPOSITION FOR REMOVING PHOTOSENSITIVE RESIN COMPOSITION
摘要 PURPOSE: A thinner composition for removing a photosensitive resin composition is provided, to effectively remove the black resist adhered to the edge and back face of a glass substrate in short time and to reduce the step of interface. CONSTITUTION: The thinner composition comprises 1-50 parts by weight of propylene glycol monoalkyl ether; 50-99 parts by weight of alkyl ethanoate; 1-10 parts by weight of γ -butyrolactone; and 0.001-1 parts by weight of polyethylene oxide condensate of alkyl phenol as a surfactant. Also the thinner composition comprises 1-50 parts by weight of propylene glycol monoalkyl ether; 50-99 parts by weight of alkyl ethanoate; 1-10 parts by weight of γ -butyrolactone; and 0.001-1 parts by weight of linear-chained alkyl benzenesulfonic acid. Also the thinner composition comprises 1-50 parts by weight of propylene glycol monoalkyl ether; 50-99 parts by weight of alkyl ethanoate; 1-10 parts by weight of γ-butyrolactone; 0.001-1 parts by weight of polyethylene oxide condensate of alkyl phenol as a surfactant; and 0.001-1 parts by weight of linear-chained alkyl benzenesulfonic acid. Preferably the linear-chained alkyl benzenesulfonic acid is represented by the formula 1, wherein R is a linear alkyl group of C10-C14.
申请公布号 KR20030069688(A) 申请公布日期 2003.08.27
申请号 KR20020009618 申请日期 2002.02.22
申请人 DONGJIN SEMICHEM CO., LTD. 发明人 JUN, U SIK;LEE, SANG DAE;PARK, SUN HUI
分类号 G03F7/32;(IPC1-7):G03F7/32 主分类号 G03F7/32
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