| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a photosensitive resin composition comprising a polyimide precursor which lowers the coefficient of thermal expansion in imidation, developable with an aqueous alkali solution and having sharp negative pattern forming ability. <P>SOLUTION: The photosensitive resin composition comprises (A) a polyimide precursor of formula (1) (where R<SP>1</SP>and R<SP>2</SP>are each an aromatic organic group; R<SP>3</SP>and R<SP>4</SP>are each an aromatic organic group; R<SP>5</SP>and R<SP>6</SP>are each an organic group having an ethylenically unsaturated bond; and R<SP>7</SP>and R<SP>8</SP>are each an organic group having an α,β-unsaturated bond), (B) a dehydration condensing agent for production of the polyimide precursor, (C) a photosensitive agent to an actinic ray and (D) a solvent. A method for producing the photosensitive resin composition is provided. <P>COPYRIGHT: (C)2003,JPO |
