AUTO CONTROL SYSTEM FOR FILM THICKNESS IN SEMICONDUCTOR FABRICATION AND CONTROLLING METHOD THEREOF

摘要

PURPOSE: An auto control system for film thickness in semiconductor fabrication is provided to form a uniform thickness by inputting a correction value to the automatic thickness control system so that the process condition of a diffusion furnace is controlled. CONSTITUTION: Process equipment is for forming a thin film on a semiconductor substrate having various semiconductor devices. An equipment control apparatus controls the operation of the process equipment, having information of the correction value for controlling the thickness of the thin film according to the various semiconductor devices. An operator computer(20) reads the information regarding a process condition for forming the thin film from the equipment control apparatus and receives the information of the correction value for controlling the thickness of the thin film. The operator computer automatically corrects the information regarding the process condition and supplies the corrected information to the equipment control apparatus so that the process equipment can be operated by the corrected process condition.