发明名称 HEAT-RESISTANT RESIN PRECURSOR, HEAT-RESISTANT RESIN, INSULATION FILM MATERIAL, AND SEMICONDUCTOR DEVICE USING THE SAME
摘要 PROBLEM TO BE SOLVED: To provide a resin precursor which has good processability owing to its solubility in an organic solvent, develops improved heat resistance after being formed into a cyclized product being the form of use, and gives a resin excellent in electrical properties, physical properties, and mechanical properties and suitable for uses such as an interlayer insulation film in a semiconductor. SOLUTION: An (organic solution) of a polybenzoxazole resin precursor having repeating units represented by formula (A) [wherein m and n are integers giving the sum of 2-1,000 and satisfying the relationships: 0.05≤(m/(m+n))≤1] is converted into an oxazole through a dehydrative condensation reaction and a crosslinking reaction, and the obtained polybenzoxazole resin is used as an insulation film material to form an insulation material. COPYRIGHT: (C)2003,JPO
申请公布号 JP2003238685(A) 申请公布日期 2003.08.27
申请号 JP20020040743 申请日期 2002.02.18
申请人 SUMITOMO BAKELITE CO LTD 发明人 ISHIDA YUICHI;ENOKI HISAFUMI
分类号 C08J5/18;C08G73/22;H01L21/312;(IPC1-7):C08G73/22 主分类号 C08J5/18
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