发明名称 METHOD AND APPARATUS FOR ASSEMBLING SUBSTRATE
摘要 PROBLEM TO BE SOLVED: To provide a substrate assembly method and an apparatus therefor for sticking substrates together under a vacuum with high precision even when the substrates become larger and thinner. SOLUTION: In the method for assembling substrates, one substrate 1a to be stuck is held opposite to the other substrate 1b to be stuck, and both substrates are stuck under a vacuum with an adhesive member 52 provided to one of the substrates. The substrate 1a is held by a chamber unit 6 as a sticking means incorporated in a pressure plate 7 and stuck on the other substrate 1b. Then the sticking means is moved back into the pressure plate 7. COPYRIGHT: (C)2003,JPO
申请公布号 JP2003241160(A) 申请公布日期 2003.08.27
申请号 JP20030017800 申请日期 2003.01.27
申请人 HITACHI INDUSTRIES CO LTD 发明人 HACHIMAN SATOSHI;IMAIZUMI KIYOSHI;SAITO MASAYUKI;HIRAI AKIRA
分类号 G02F1/13;G02F1/1339;(IPC1-7):G02F1/13;G02F1/133 主分类号 G02F1/13
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