发明名称 |
METHOD AND APPARATUS FOR ASSEMBLING SUBSTRATE |
摘要 |
PROBLEM TO BE SOLVED: To provide a substrate assembly method and an apparatus therefor for sticking substrates together under a vacuum with high precision even when the substrates become larger and thinner. SOLUTION: In the method for assembling substrates, one substrate 1a to be stuck is held opposite to the other substrate 1b to be stuck, and both substrates are stuck under a vacuum with an adhesive member 52 provided to one of the substrates. The substrate 1a is held by a chamber unit 6 as a sticking means incorporated in a pressure plate 7 and stuck on the other substrate 1b. Then the sticking means is moved back into the pressure plate 7. COPYRIGHT: (C)2003,JPO
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申请公布号 |
JP2003241160(A) |
申请公布日期 |
2003.08.27 |
申请号 |
JP20030017800 |
申请日期 |
2003.01.27 |
申请人 |
HITACHI INDUSTRIES CO LTD |
发明人 |
HACHIMAN SATOSHI;IMAIZUMI KIYOSHI;SAITO MASAYUKI;HIRAI AKIRA |
分类号 |
G02F1/13;G02F1/1339;(IPC1-7):G02F1/13;G02F1/133 |
主分类号 |
G02F1/13 |
代理机构 |
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代理人 |
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