| 摘要 |
PROBLEM TO BE SOLVED: To provide an IC package tray with a guide rail for preventing a stack from being broken loose by which an outer lead is prevented from being deformed. SOLUTION: The guide rail is provided on a top part of a lower stage tray and a protruded part is provided on a bottom part of an upper stage tray. It is possible thereby that when the trays are stacked, by utilizing a method wherein the protruded part of the upper stage tray is slid and set on the rail of the lower stage tray, there hardly exists a gap between the trays each other and a stabilized condition can be kept. COPYRIGHT: (C)2003,JPO
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