| 摘要 |
PURPOSE: A method for cutting a semiconductor package is provided to reduce a damage of the semiconductor package and enhance productivity of the semiconductor package by improving a cutting process of the semiconductor package. CONSTITUTION: A loading process of a semiconductor package is performed by loading a semiconductor package on a vacuum station(100). The semiconductor package is fixed on the vacuum station by vacuum. A pre-cutting process is performed by cutting particular units of the semiconductor package(110). The particular units of the semiconductor package are cut by using a dicing wheel. A cleaning and a drying process is performed to clean cut sludge caused by the pre-cutting process(120). A laser beam cutting process is performed by cutting the remaining thickness of the semiconductor package(130).
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