| 摘要 |
Polishing slurry comprises (wt.%): (1) a colloidal silicon dioxide abrasive (5-50); and (2) a quaternary ammonium salt (0.1-10). Polishing slurry comprises (wt.%): (1) a colloidal silicon dioxide abrasive (5-50); and (2) a quaternary ammonium salt (0.1-10) of formula, R4N<+>X<-> (I). R = alkyl, alkenyl, alkylaryl, arylalkyl or ester; and X = hydroxy or halogen. |
