| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a bonding method causing no foam. <P>SOLUTION: An adhesive 37 in a state of being set up in an adhesive vessel 30 is made heating/vacuum/centrifugal degassing to semicure it, and then the semicured product is discharged with the state of being set up in the adhesive vessel 30, and further is loaded with a chip. Since the semicuring and the degassing is made at the same time, the removing foam is effectively made. Furthermore, there is no process to be semicured for the discharged adhesive, consequently, no defective product is caused even when a working process is stopped. <P>COPYRIGHT: (C)2003,JPO |
