| 摘要 |
PROBLEM TO BE SOLVED: To provide a resin composition suitable for a large gauge wafer, which in connection with a manufacturing method of a wafer level package, retains conventional characteristics, and besides, can produce cured matter having a small linear expansion coefficient, a small elastic modulus and a small curing shrinkage. SOLUTION: The liquid resin composition comprises (A) a liquid epoxy resin, (B) a curing agent, and (C) an inorganic filler as essential components. The liquid epoxy resin contains at least 30 wt.% product obtained by reacting an epoxy resin (a) represented by formula (1) with a bisphenol at a functional- group-number ratio in the charge weight the number of epoxy groups of (a)/the number of hydroxy groups of (b) of 1.05-5. COPYRIGHT: (C)2003,JPO
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