| 摘要 |
<p>A control section controls an operation of a vertical drive section for vertically moving a cutter unit, and thereby, a blade edge position (height) of the cutter unit can be set and changed with micro intervals. Namely, when cutting a protective tape applied onto a surface of wafer, a contact portion of the protective tape and the blade edge is properly changed, and thereby, the protective tape can be always cut by a sharp blade edge along an outline of the wafer. <IMAGE></p> |
