| 摘要 |
An electronic component is provided with a connection conductive layer containing a 0.05 weight percent to 1.5 weight percent of nickel in a Sn-Bi (tin-bismuth) alloy on a surface of a lead used as an external terminal. Nickel (Ni) crystallizes as a deposition phase in a tin-bismuth alloy structure and acts to inhibit component atoms making up the Sn-Bi alloy from migrating along a crystal grain boundary between two tin (Sn) crystal grains being adjacent to each other. Therefore, a secular change of the alloy structure of the Sn-Bi alloy used as the connection conductive layer becomes small. |
