| 摘要 |
A method of soldering a ball grid array device onto a circuit board which includes: positioning a solder paste brick on top of a contact pad of the circuit board, said solder past brick defining an irregularly shaped structure such that a majority of a top surface of the solder paste brick is not in contact with the solder ball terminal, wherein volatized flux gases formed during heating escape via the top surface without migrating upwardly into the solder ball terminal; attaching the ball grid array device onto the circuit board such that a solder ball terminal of the ball grid array device makes contact with a portion of an edge of the solder paste brick while remaining substantially aligned with a center of the pad; and heating the ball grid array device and the circuit board so as to melt the solder ball terminal and the solder paste brick, thereby forming a solder joint between the ball grid array device and the circuit board.
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