SOLDERING APPARATUS

摘要

PROBLEM TO BE SOLVED: To provide a soldering apparatus with which fine adjustment of a nozzle can be obtained according to a work even during driving of the soldering apparatus. SOLUTION: A front jetting guide plate 33 for guiding molten solder stream returning back into a solder vessel 12 from a jetting hole 26 is rotatably supported in the advancing side of the work W from a jetting hole 26 of a secondary nozzle 23 for jetting the molten solder 11 in a solder vessel 12 to the work W moved at the upper side. A front jetting guide plate adjusting mechanism 37 for adjusting an angle of the front guide plate 33 from the outer part of the solder vessel 12 to the front guide plate 33 is arranged. A weir plate 36 for overflowing the molten solder stream on the front jetting guide plate 33 is arranged so as to be freely and vertically moved at a position faced to the tip end part of the front jetting guide plate 33. A weir plate adjusting mechanism 61 for adjusting the height of the weir plate 36 from the outer part of the solder vessel 12 to the weir plate 36 is arranged. COPYRIGHT: (C)2003,JPO