B-STAGE RESIN COMPOSITION SHEET FOR ADDITIVE USE FILLED WITH HEAT-RESISTANT FILM BASE MATERIAL AND WITH METAL FOIL

摘要

PROBLEM TO BE SOLVED: To obtain an adhesive sheet for manufacturing a build-up printed- wiring board with excellent plating copper adhesive force, heat resistance, elastic modulus and reliability by an additive method. SOLUTION: A B-stage resin composition sheet for additive use filled with a heat-resistant film base material and with a metal foil with a constitution in which a base material-reinforced B-stage resin composition layer c stuck on the heat-resistant film base material is bonded on the resin side of the resin composition layer for additive use formed on the surface of a metal foil a with a surface unevenness, is used. COPYRIGHT: (C)2003,JPO