发明名称 |
Heat treatment apparatus and method |
摘要 |
A heat treatment apparatus comprises: a chamber; a cooling plate and a heating plate disposed within the chamber vertically spaced from each other; plural lift pins used to support a material to be treated; a supporting member for supporting the plural lift pins; and an elevator member to which the supporting member is attached through a joint so that the supporting member can be selectively made rotatable and can be fixed at any inclined angle, wherein distances of tips of each of the lift pins from the heating or cooling plate are initially adjusted to be uniform through inclination of the supporting member while the tips contact the heating or cooling plate, after which the supporting member is fixed in an adjusted inclined angle and then the material to be treated is lifted up with the plural lift pins to closely approach the heating or cooling plate during heat treatment.
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申请公布号 |
US6609909(B2) |
申请公布日期 |
2003.08.26 |
申请号 |
US20010981633 |
申请日期 |
2001.10.17 |
申请人 |
TOKYO OHKA KOGYO C., LTD. |
发明人 |
AOKI TAIICHIRO;NAKAMURA AKIHIKO;NISHIE AKINORI;IMAI TOSHINORI;NISHIE AKINORI |
分类号 |
H01L21/683;H01L21/00;H01L21/027;H01L21/324;(IPC1-7):F27D5/00 |
主分类号 |
H01L21/683 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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