| 摘要 |
A compact laser package having a submount with a plurality of electrical contact pads and a plurality of electrical connection lines formed thereon. The submount may be configured to receive at least one optical component thereon, the at least one optical component being in electrical communication with at least one of the plurality of electrical connection lines. A lid is provided, the lid having a recessed portion and a groove formed therein, the recessed portion being positioned in an interior of the lid and the groove being positioned to intersect the recessed portion and a peripheral edge of the lid. The submount is generally configured to cooperatively engage the lid to form a hermetically sealed laser package.
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