发明名称 |
Multi-chip module utilizing leadframe |
摘要 |
A multi-chip module includes metal frame segments including a plurality of die-bonding pads and a plurality of terminals, a plurality of electronic components mounted on the die-bonding pads in electrical connection to the terminals, and a resin package for enclosing the electronic components and the metal frame segments with each of the terminals partially projecting outwardly from the resin package. Selected ones of the electronic components are electrically connected to each other via the metal frame segments and wires within the resin package.
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申请公布号 |
US6610923(B1) |
申请公布日期 |
2003.08.26 |
申请号 |
US20000704801 |
申请日期 |
2000.11.03 |
申请人 |
ROHM CO., LTD. |
发明人 |
NAGASHIMA MITSUNORI;NISHIMURA KOHSHI |
分类号 |
H01L25/00;H01L23/495;(IPC1-7):H05K5/06 |
主分类号 |
H01L25/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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