| 摘要 |
PROBLEM TO BE SOLVED: To improve joined strength with soldering by restraining diffusion of nickel into fused solder alloy and preventing the concentration of phosphorus at the soldering time. SOLUTION: In a flux used in the case of soldering in a substrate applying a non-electrolytic nickel plating, the flux for soldering is contained of 1-20 wt.% metallic salt therein. COPYRIGHT: (C)2003,JPO
|
