| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for dividing a substrate of an opaque substrate. SOLUTION: The substrate is fixed by adhering one side principal plane of the substrate 1 on an adhesive sheet 2a. The end faces 9a and 9b of the substrate to function as a position reference are formed on the substrate. Kerfs 5a and 5b having a predetermined depth are formed on the other side principal plane thereof by referring to the end face of the substrate and then the substrate is peeled off from the adhesive sheet and turned over. The other side principal plane of the substrate is applied on a separate adhesive sheet 2b and fixed. The substrate is divided into chips by forming the kerfs 7a and 7b at the kerf position which is formed in advance and with a depth which reaches to the kerf on one side principal plane thereof by referring to the end face of the substrate. Even the opaque substrate can be accurately divided into chips and quality of the chip can be enhanced. COPYRIGHT: (C)2003,JPO
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