发明名称 Exposed paddle leadframe for semiconductor die packaging
摘要 According to one embodiment, a leadframe having at least one tab is placed inside a mold cavity. During the molding process, the ceiling of the mold cavity is pressed against the at least one tab, which in turn causes a bottom surface of the leadframe to be pressed firmly against a floor of the mold cavity. When a mold compound is injected into the mold cavity, the mold compound is prevented from reaching under the bottom surface of the leadframe. In one embodiment, the tabs are etched into one of the tie bars in the leadframe. The tabs are then mechanically formed at a nonzero angle with respect to a plane of a frame of the leadframe.
申请公布号 US6611048(B1) 申请公布日期 2003.08.26
申请号 US20000648879 申请日期 2000.08.25
申请人 SKYWORKS SOLUTIONS, INC. 发明人 FAZELPOUR SIAMAK;VILLANUEVA ROBERTO U.
分类号 H01L21/56;H01L23/495;(IPC1-7):H01L23/495;H01L23/48 主分类号 H01L21/56
代理机构 代理人
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