| 摘要 |
<P>PROBLEM TO BE SOLVED: To commercially provide a heat resistant laminate film which scantly curls while sufficing properties such as heat resistance, insulation reliability, adhesion and a metal layered laminate using the same as well as to provide a highly reliable semiconductor device. <P>SOLUTION: The heat resistant laminate film having an adhesive layer on at least one side of its heat resistant insulating film wherein an absolute value of ▵n.d, the product of birefringent index (▵n) and film thickness (d) of the adhesive layer after cure, is 8 nm or lower, the metal layered laminate film obtained by laminating a metal layer on said heat resistant laminate film and the semiconductor device using said metal layered laminate film. <P>COPYRIGHT: (C)2003,JPO |
