FINGERPRINT SENSOR ARRANGEMENT AND PRODUCTION METHOD THEREFOR

摘要

PROBLEM TO BE SOLVED: To provide a fingerprint sensor arrangement in which a normal fingerprint sensor function can be maintained even when a mold flash occurs, and a finger is easily moved by suppressing the height of a resin part around a sensor part in a sweep type fingerprint sensor.

SOLUTION: The fingerprint sensor arrangement has a semiconductor chip 2 in which a sensor part 4 is formed on the surface thereof and a sealing resin part 10 for sealing the semiconductor chip 2. The sensor part 4 is exposed on the bottom of an opening 18 formed on the sealing resin part 10. A distance between the terminal of the bottom of the opening part 18 and the terminal of the sensor part 4 is from 0.3 mm to 1.0 mm.

COPYRIGHT: (C)2003,JPO