发明名称 PLANE GRINDING METHOD
摘要 PROBLEM TO BE SOLVED: To provide a plane grinding method capable of reducing a grinding trace appearing after grinding a plane when sparking out. SOLUTION: In this plane grinding method in which a grinding wheel fixed to a spindle through a grinding wheel holding part and a basic plate fixed on a chuck table are opposingly arranged by deviating them on sides for each other so that a side end part of the grinding wheel coincides with shaft center of a rotary shaft of the chuck table substantially, and the grinding wheel is pressed against the basic plate while rotating and driving the chuck table and the spindle, respectively, to grind a machining face of the basic plate, the plane grinding method in which a ratio of the number of revolutions obtained by dividing the number of revolutions of the spindle by the number of revolutions of the chuck table is set to be a value which is not an integer when sparking out is provided. Owing to this configuration, a grinding trace can be reduced by deviating a position of a region on the machining face where the grinding stone interferes with an action face during one revolution every time the basic plate rotates by one revolution when sparking out. COPYRIGHT: (C)2003,JPO
申请公布号 JP2003236736(A) 申请公布日期 2003.08.26
申请号 JP20020039881 申请日期 2002.02.18
申请人 DISCO ABRASIVE SYST LTD 发明人 KIYU TOSHIAKI;OZAWA NARUTOSHI;YUGAWA ISAO;MIURA OSAMU
分类号 B24B7/04;B24B1/00;H01L21/304;(IPC1-7):B24B7/04 主分类号 B24B7/04
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