发明名称 Semiconductor wafer processing system with vertically-stacked process chambers and single-axis dual-wafer transfer system
摘要 A semiconductor wafer processing system including a multi-chamber module having vertically-stacked semiconductor wafer process chambers and a loadlock chamber dedicated to each semiconductor wafer process chamber. Each process chamber includes a chuck for holding a wafer during wafer processing. The multi-chamber modules may be oriented in a linear array. The system further includes an apparatus having a dual-wafer single-axis transfer arm including a monolithic arm pivotally mounted within said loadlock chamber about a single pivot axis. The apparatus is adapted to carry two wafers, one unprocessed and one processed, simultaneously between the loadlock chamber and the process chamber. A method utilizing the disclosed system is also provided.
申请公布号 US6610150(B1) 申请公布日期 2003.08.26
申请号 US20000483945 申请日期 2000.01.13
申请人 ASML US, INC. 发明人 SAVAGE RICHARD N.;MENAGH FRANK S.;CARVALHEIRA HELDER R.;TROIANI PHILIP A.;COSSENTINE DAN L.;VAUGHAN ERIC R.;MAYER BRUCE E.
分类号 G03F7/20;C23C16/54;H01L21/00;H01L21/02;H01L21/31;H01L21/677;H01L21/687;(IPC1-7):C23C16/00 主分类号 G03F7/20
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