发明名称 METHOD FOR MANUFACTURING LAMINATED BODY AND PRINTED- WIRING BOARD
摘要 PROBLEM TO BE SOLVED: To provide a printed-wiring board having excellent adhesiveness, circuit shape and insulation properties between wirings in a laminated body of a polymer and a metal layer which can realize the printed-wiring board with a high density by a semi-additive method. SOLUTION: The laminated body comprises a first metal layer of nickel or a nickel alloy formed on a surface of a polymer film with a smooth surface by a physical technique, a second metal layer prepared by an electroless nickel plating and a third metal layer by an electric copper plating, and it is manufactured by using an etching liquid in which an etching speed of nickel or the nickel alloy is at least twofold of the etching speed of copper and nickel or its alloy is selectively etched when the first and second metal films are etched. COPYRIGHT: (C)2003,JPO
申请公布号 JP2003236982(A) 申请公布日期 2003.08.26
申请号 JP20020039274 申请日期 2002.02.15
申请人 KANEGAFUCHI CHEM IND CO LTD 发明人 NISHINAKA MASARU;ITO TAKU;MURAKAMI MUTSUAKI
分类号 H05K1/09;B32B15/08;H05K3/24;H05K3/38;(IPC1-7):B32B15/08 主分类号 H05K1/09
代理机构 代理人
主权项
地址