发明名称 |
Process for the wet chemical treatment of a semiconductor wafer |
摘要 |
A process for the wet chemical treatment of a semiconductor wafer in a vessel, in which the semiconductor wafer is brought into contact with a liquid in which very small gas bubbles are dispersed. Two circuits are set up for conveying the liquid, with a first circuit between a reservoir and the vessel, for conveying the liquid from the reservoir to the vessel; and with a second circuit from the reservoir back to the reservoir, in order to enrich the liquid with a gas on the way back to the reservoir, so that the gas bubbles can form.
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申请公布号 |
US6610213(B1) |
申请公布日期 |
2003.08.26 |
申请号 |
US20000575011 |
申请日期 |
2000.05.19 |
申请人 |
WACKER SILTRONIC GESELLSCHAFT FUER HALBLEITERMATERIALIEN |
发明人 |
SCHWAB GUENTER;STADLER MAXIMILIAN |
分类号 |
C30B33/10;H01L21/00;H01L21/304;H01L21/306;(IPC1-7):B44C1/22 |
主分类号 |
C30B33/10 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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