Surface mounting electronic component

摘要

A surface mounting electronic component with external electrodes has a structure in which plated coatings are laminated on metallic coatings by a wet barrel plating method, so as to achieve reduced variation in thickness of the plated coatings of the plurality of external electrodes and reduced defective component frequency rate, with the result that materials for the plated coatings can be utilized efficiently. A plurality of external electrodes are disposed on the outer surfaces of an electronic component body. Each of the external electrodes includes metallic coatings and plated coatings disposed on the metallic coatings by a wet plating method. The area of each of the plurality of electrodes is approximately the same, and the total of lengths of each of the external electrodes on the edges of the electronic component body is approximately the same.