| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a method for manufacturing a resistance plate laminated material capable of forming a resistor having a required resistance value in a wiring pattern formed by etching and to provide a method for manufacturing a component using the resistance plate laminated material. <P>SOLUTION: The method for manufacturing the resistance plate laminated material comprises the steps of stacking a conductive plate 24 having excellent conductivity and a plurality of resistance plates 28 each having a predetermined specific resistance, activating the surfaces to be connected, then bringing the activated surfaces into contact with each other to be opposed, lap laminate connecting the surfaces to manufacture the resistance plate laminated material 20 capable of forming a resistor having a required resistance in a wiring pattern. The component to be applied to a printed circuit board, an IC package or the like is manufactured by using the resistance plate laminated material 20. <P>COPYRIGHT: (C)2003,JPO</p> |
