| 摘要 |
PROBLEM TO BE SOLVED: To provide a laminated foamed sheet of polypropylene resin which is free of problems such as drawdown and partial peeling of a film layer from a foamed layer and excellent in antistatic properties, and to provide a molded vessel which protects the contents from an impact in transport, reduces troubles of static electricity and is suitable for a package of an electronic component, by hot-molding the sheet. SOLUTION: A biaxially oriented antistatic polypropylene resin film is laminated on a polypropylene resin foamed sheet of which the percentage of closed cells in a specified range of density is 40% or above. Thereby a resin laminated foamed sheet of which the surface resistivity is less than 10<SP>12</SP>Ω, the polypropylene resin laminated foamed sheet of which the heating shrinkage factor of the antistatic polypropylene resin film is 1.5-4.0%, and a hot-molded vessel thereof, are obtained. The resin used for the foamed sheet has preferably a melt tension in a specified range. COPYRIGHT: (C)2003,JPO
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