发明名称 Embedded electronics for high convection cooling in an engine cooling motor application
摘要 A cooling assembly includes an electric motor 10 for driving a fan 16. At least one spoke structure 18 is coupled to and extends generally radially from a periphery of the motor body so as to be exposed to airflow caused by rotation of the fan 16. An electronic component 24 of the motor is operatively associated with the spoke structure 18 such that heat of the electronic component is conducted to the spoke structure and to a spoke extension 22.
申请公布号 US6611071(B2) 申请公布日期 2003.08.26
申请号 US20010931735 申请日期 2001.08.17
申请人 SIEMENS AUTOMOTIVE INC. 发明人 STAUDER FRANK A.;NAISH DAVID J.
分类号 F04D27/02;H02K9/06;H02K11/04;(IPC1-7):H02K11/00;H02K9/04 主分类号 F04D27/02
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