发明名称 |
Removal of metal veils from via holes |
摘要 |
A method for making an ICD or MEOD structure includes dry etching a structure to produce one or more via holes in an upper layer of the structure. The dry etching step stops on a metal layer that underlies the upper layer in the structure. The method also includes cleaning the dry etched structure with an aqueous solution that includes hydrogen peroxide and either an ammonium salt or an amine salt.
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申请公布号 |
US6610599(B1) |
申请公布日期 |
2003.08.26 |
申请号 |
US20020175459 |
申请日期 |
2002.06.19 |
申请人 |
LUCENT TECHNOLOGIES INC. |
发明人 |
CHUA LAY-LAY;LIU CHUN-TING;YANG YANG |
分类号 |
C11D3/39;C11D7/10;C11D11/00;H01L21/306;H01L21/311;H01L21/768;(IPC1-7):H01L21/44;C11D9/04 |
主分类号 |
C11D3/39 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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