发明名称 Dressing apparatus and polishing apparatus
摘要 A dressing apparatus is used for dressing a polishing surface of a polishing table used for polishing a workpiece such as a semiconductor wafer. The dressing apparatus for dressing apparatus comprises a dresser having a dressing surface for dressing the polishing surface, and the dressing surface has an area which covers an entire area of the polishing surface.
申请公布号 US6609962(B1) 申请公布日期 2003.08.26
申请号 US20000572629 申请日期 2000.05.17
申请人 EBARA CORPORATION 发明人 WAKABAYASHI SATOSHI;YAMAGUCHI KUNIAKI;TOGAWA TETSUJI;TAKADA NOBUYUKI;NABEYA OSAMU
分类号 B24B53/02;B24B1/04;B24B37/00;B24B37/04;B24B53/00;B24B53/007;B24B53/017;B24B53/12;B24B55/06;H01L21/302;H01L21/304;(IPC1-7):B24B1/00 主分类号 B24B53/02
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